FITI GROUP

Introduction

Core Business：
Critical spare part fabrication and repair service for semiconductor equipment module.

1. 2014/11 SSBU was founded

2. 2017/10 Admitted to Hsinchu Science Park Chunan Campus

3. 2020/10 Groundbreaking of Chuan 2A site

4. 2020/12 SSBU was eligible for Bonded Factory

5. 2022/10 Grand opening of Chunan 2A site

Process

Different types of faceplates and blocker plates

Different types of faceplates and blocker plates is the basis of wafer processing. Layers of thin film with different functions are formed on the wafer surface to fulfill device properties requirements.

The critical spare parts produced by Foxsemicon cover five different types of faceplates and blocker plates including：

1. Dielectric Deposition - Air flow rectifier-12" (300 mm)

2. Physic Vapor Deposition - Flux Optimizer

3. High Selectivity Etching - Air flow rectifier-12" (300 mm)

4. Epitaxy Eveness Improvement-12" (300 mm)

5. Atomic Layer Deposition - Air flow rectifier 12" (300 mm)

CMP head repair service

Chemical-Mechanical Planarization (CMP) removes the roughness of wafer surface with polishing liquid to improve surface flatness for subsequent circuit fabrication.

Foxsemicon provides CMP head repair and maintanense service.

SEMI Spare Biz Unit

Introduction

Process