About Us
Founded in 2019 as a subsidiary company under Foxconn/ Foxsemicon Technology Group, Kainova believes in flexibility, adaptability, and meeting customers' needs efficiently. Kainova welcomes challenges and values profession. With 20+ years of experience and our parent companies’ production capacity, we aspire to provide advanced equipment, introduce enginnering solutions and build innovative business models for semiconductor equipment/ fabs.
Mission and Vision
We strive to enhance yield and productivity for semiconductor fabrication customers by:
1. Offering reliable semiconductor fabrication automation solutions.
2. Delivering comprehensive solutions for micro-contaminant control.
3. Producing accurate wafer inspection systems.
4. Providing quality semiconductor equipment CIP and retrofit services.
With over 20 years of experience, we are well-established in semiconductor equipment, factory automation and micro-contamination prevention.
Ultra-clean mechanism designs, circuit designs, engineering analysis, motion control, PC/ PLC software development, semiconductor SECS/ GEM communication development, system design solutions.
We collaborate with global partner, research institutes and top universities to ensure world-leading technology.
PAMCOH™ Total Solutions
► PAMCOH™ active micro contamination control total solutions protect wafers within processes, transportation and storage without dead zone.
SCUBA® – Load Port Purge Subsystem
一、Function：The SCUBA System is designed to ensure that wafers stay in the low humidity and low oxygen environment between manufacturing processes. The system is a subsystem which can be installed inside Load Port. It purges FOUP with nitrogen and real-time monitors the condition of the FOUP.
二、Product Specifications： 1. Flow Meter Control 200 SLPM max. 2. High Purity Filter 99.9999999% @>0.003um 3. SECS Communication 4. Purge Performance: Humidity < 10% after 2 mins purge 5. Temperature and Humidity Sensor 6. Fit to all brands of Load Port
VENTO™ – Stand Alone N2 Charger
一、Function：The VENTO System is designed to ensure that wafers stay in the low humidity and low oxygen environment between manufacturing processes. The system purges FOUP with nitrogen and real-time monitors the condition of the FOUP.
二、Product Specifications： 1. Standalone model, able to connect with AMHS system 2. Full-automatically purge N2 into FOUP 3. Flow Meter Control 200 SLPM max. 4. High Purity Filter 99.9999999% @>0.003um 5. SECS II Communication 6. Purge Performance: Humidity < 10% after 2 mins purge 7. Temperature and Humidity Sensor 8. Optional O2 Detector if needed
Functional Water Supply System
一、Function：Used for semiconductor cleaning process to improve wafer yields. Mainly used to remove particles/ humidity and decrease oxidation.
二、Product Specifications：
Wafer Sorter
一、Function： 1. Transfer wafers from FOSB to FOUP 2. Transfer and sort wafers between FOUPs 3. Sort, merge, split wafer lots according to recipe
二、Product Specifications： 1. Throughput: 600 WPH 2. Double sided wafer ID reading 3. Repeatability ±0.05mm 4. ISO Class 3 cleanliness 5.Compatible to 200mm and 300mm silicon wafer, glass wafer and compound semiconductor wafer
Coin Stack Storage and Unpacking Wafer Sorter
一、Function： 1. Automatically store coin stack wafer boxes in N2 environment 2. Automatically unpack coin stack wafer box and pick up wafers and spacers inside 3. Sort and transfer wafers to corresponding FOUP by wafer ID
二、Product Specifications： 1. Maximum storage: 87 boxes( 2175 wafers) 2. Throughput: 200 WPH 3. ISO Class 3 (FED-STD-209E Class 1) cleanliness 4. Fully automated wafer and box handling with 3 robots
Pack Unpack Wafer Sorter
一、Function： 1. Automatically unpack coin stack wafer box and pick up wafers and spacers inside 2. Sort and transfer wafers to corresponding FOUP by wafer ID 3. Automatically transfer wafers into wafer box and pack wafer box
二、Product Specifications： 1. Throughput: 500 WPH 2. ISO Class 3 (FED-STD-209E Class 1) cleanliness 3. Fully automated wafer and box handling with dual robots
Full-Auto Pellicle Mounter for EUV Mask
一、Function： 1. Automatically open Reticle Pod and Pellicle Case and extract EUV Mask and Pellicle 2. Remove protective film from pellicle 3. Align and mount pellicle onto EUV mask 4. Inspect appearance, defect, position and mounting precision of pellicle and mask with AOI
二、Product Specifications： 1. Optical distortion < 3nm 2. Mounting accuracy ±0.1mm 3. Controlling less than 50nm particles 4. ISO Class 2 cleanliness
Reticle Pod Exchanger
一、Function： 1. Fully automated opening and accessing various reticle pods 2. Transfer reticles between reticle pods 3. Recognize reticle type and rotate the orientation by type
二、Product Specifications： 1. 3 load ports for different reticle pod types 2. Controlling less than 50nm particles 3. Built-in N2 purge function in load ports, purge rate 10 LPM 4. ISO Class 2 (FED-STD-209E Class 0.1)
Equipment Front-End Module (EFEM)
二、Product Specifications： 1. Transfer time: <15 seconds 2. Throughput: 600 WPH 3. Positioning accuracy: ±0.05mm 4. ISO Class 3 (FED-STD-209E Class 1) cleanliness
Wafer Macro/Micro Inspection
一、Function：Wafer inspection to ensure stable quality after fabrication.
二、Product Specifications： 1. Automated visual and microscope inspection for patterned wafer 2. Macro inspection: visual inspect with flip function and joystick operated tilt ± 45 degree for both sides 3. Micro inspection: inspected by CCD image 4. 2-way wafer loader: coin stack box and FOSB 5. Precise microscope stage with motorized X-Y stage by joystick 6. Granite microscope base with vibration damper 7. Fully automated optical inspection expandable 8. 500X microscope 9. ISO Class 4 (FED-STD-209E Class 10) cleanliness