FITI GROUP

Introduction

Since 2001, Foxsemicon's advanced technique in manufacturing and high quality products have strengthened the partnership with our customers.

Foxsemicon produces equipments cover the front-end manufacturing process and back-end packaging and testing of semiconductors, including piece parts, vacuum chambers, sub-system modules, and system assemblies.

Adhering to the production and service principles of extraordinary quality and sustainable management, Foxsemicon keeps carrying out technological innovation to meet customer demands and gain market share.

Manufacturing Process and Products

Thin Film Process

Thin Film Process is the basis of wafer processing. Layers of thin film with different functions are formed on the wafer surface to fulfill device properties requirements.

The equipment components produced by Foxsemicon cover three major thin film processes, which are Chemical Vapor Deposition(CVD), Physical Vapor Deposition(PVD), and Atomic Layer Deposition(ALD). The components include:

1. Vacuum chambers that can reach high vacuum level.

2. Gasboxes that store the reaction gas, showerheads that diffuse the reaction gas flow into the chamber.

3. Chamber lids that seal the vacuum chamber.

Foxsemicon could also provide customized assembling service.

Gas Distribution Components: Precise and reliable gas distribution is fundamental to process stability, repeatability, and equipment uptime in semiconductor manufacturing. Foxsemicon supports the manufacturing of high-precision gas distribution components, including critical structural parts designed for vacuum and process environments, meeting the requirements of semiconductor and advanced manufacturing equipment for accuracy, cleanliness, and structural reliability.

Etching

Etching is the process of selectively removing various thin film layers through chemical solvents or plasma.

Foxsemicon excels in:

1. Machine frames.

2. Vacuum chambers.

3. Plasma etching electrode devices (Cathode).

4. Integrating command and control module equipments per customer's process requirements to achieve excellent etching profile.

CMP

Chemical-Mechanical Planarization (CMP) removes the roughness of wafer surface with polishing liquid to improve surface flatness for subsequent circuit fabrication.

The components produced by Foxsemicon include products such as grinding heads and assembled plastic parts.

Process Control

Wafer Handling

Automatic wafer handling system plays an important role in the transition between semiconductor processes, as well as the maintenance of the vacuum environment.

Foxsemicon produces:

1. Robot wrist for handling wafers.

2. Transfer chamber for wafer transfer.

3. Gasline for transporting gas flow in process equipments.

Cooling Device

Plasma-Enhanced Chemical Vapor Deposition (PECVD) allows thin film formation in low temperature, so it is widely used in semiconductor processing.

The devices produced by Foxsemicon include cooling plate, cooling hub, cooling adapter, and water cooling components (input/output manifold).

Equipment Fabrication and Service Business Group

Introduction

Manufacturing Process and Products

Process Control