FITI GROUP

Machining

Foxsemicon Integrated Technology Inc. (Fiti) has more than 200 sets of various precision machining machines, and has been deeply involved in the manufacturing of semiconductor equipment for over 20 years, being capable of providing one-stop customized solutions based on customer requirements.

Our product types include large Aluminum/Stainless Steel Chambers, Stainless Steel Valves, Titanium Components and Critical Spare Parts for semiconductor front-end process.

With integrated manufacturing system, advanced manufacturing technology, and diversified customized services, Fiti is your best strategic partner.

Large format components machining center, Fiti's core competitiveness, has more than 80 sets of various large format machines, whose products covered semiconductor, solar and medical industries.

Adhering to the pragmatic and people-oriented concept, Fiti implements the smart factory, adopting AGV automation to reduce labor intensity. Besides, the big data system improves the transparency of management and execution, enabling to grow together with the company.

Equipment Type Available Machining Size Applied Machining Type
Vertical Gantry Milling Machining Center 6000x4000x1400 mm Max Large Format Chamber
4/5 Axis Machining Center 2800x2100x1800 mm Max High Complex Chamber
Deep Hole Drill Machine Dia3~Dia35, L=1200 mm Max Deep holes with aspect ratio greater than 30

Fiti Integrates manufacturing capabilities in valve products, especially used in the ultra-high purity applications, including precision machining, curved surface burnishing, extrude hone (AFM), electro-polishing, electro-beam welding, Class100 cleanroom hurricane cleaning, orbital welding, valves assembly, helium leak test, flow test, particle counter test and the other processes.

♦ Wetted surfaces roughness is less than Ra5 μ inch, which complies with SEMI F19 surface conditions;

♦ Class 100 cleanroom orbital welding conforms to SEMI F78 and SEMI F81 requirements;

♦ Class100 cleanroom ultra-high purity cleaning, valve assembly, 1x10-11 Torr helium leak test, particle counter test < 10 nm;

Process Process Capabilities
Lathe-Mill Cutting Center Maximum Machining Size
ΦxL 420x500 mm
Extrude Hone - AFM AFM Capability:
Media Cylinder Size 305 mm
Media Flow Rate 129L/Min
Media Pressure Min. 155 / Max. 800 psi
Orbital Welding Orbital Tube Size 2.4~63.5 mm
Hurricane Cleaning Tank Size 500x500x480 mm

Fiti focuses on semiconductor process areas in 200 mm and 300 mm Showerhead, Faceplate, and Flux Optimizer, applying high-clean, zero-pollution processes such as PVD, CVD, MDP. Fiti's drilling processing technology has become the center of excellence for Showerhead manufacturing in Asia.

➜ Precision Manufacturing Capability

♦ Drilling Hole Diameter:0.31mm (Min)

♦ Drilling Hole Quantity:30,000 (Max)

♦ Drilling Hole Aspect Ratio:37(Max)

♦ Drilling Hole Circularity:< 0.02 mm

Optical Measurement ▲

High Aspect Ratio ▲
(Left) Before Deburr / (Right) After Deburr ▲