FITI GROUP
Product Application

Machining

Foxsemicon has more than 100 large-scale machining centers, capable of achieving micron-level precision and processing large-sized components. Products serve key industries including semiconductor, solar and medical devices.

Adhering to the pragmatic and people-oriented concept, implemented the smart factory, AGV automation reduces the labor intensity. A big data system enhances management transparency and enables end-to-end production visibility.

Machine Type Vertical Gantry Milling Center 4/5 Axis Machining Center
Available Size 6000x4000x1400 mm Max 2800x2100x1800 mm Max
Application Large Chamber High Complex Chamber

UHP Stainless Steel Valve

Diaphragm Valve

‧ Helium test<1 X 10-9 scc/sec He

‧ Surface Finish Ra ≤ 5 μm

‧ Particle Counter Test < 0.01μm

Bulk Facility Valve

‧ Proof Design Pressure : 562.5 psig (38.78 barg)

‧ Series Size : 1"、1.5"、2"、3"、4"、6"

‧ Helium test ≤1 x 10-10 scc/sec He

Foxsemicon focuses on semiconductor area in 200 mm and 300 mm showerhead, faceplate, and flux optimizer, applied on PVD, CVD, MDP ultra cleanliness and zero polluted processes. Foxsemicon drilling technologies became the core of excellence of showerhead manufacturing in Asia.

Gas line:

Vacuum gas line

UHP gas line

UHP Valve & Gas line welded Assembly

‧ with 316L meeting UHP class manufactured in cleanroom environment of class 100

‧ Process Flow: gas line forming->ultral high cleaning->gas line welding

‧ Helium test <1 X 10-9 scc/sec He

‧ Particle Counter Test < 0.01μm